Login

We are experiencing technical difficulties. Your form submission has not been successful. Please accept our apologies and try again later. Details: [details]

Download

Register

We are experiencing technical difficulties. Your form submission has not been successful. Please accept our apologies and try again later. Details: [details]

Download

Thank you for registering

An email to complete your account has been sent to

Return to the website

get direct access

Fill in your details below and get direct access to content on this page

Text error notification

Text error notification

Checkbox error notification

Checkbox error notification

We are experiencing technical difficulties. Your form submission has not been successful. Please accept our apologies and try again later. Details: [details]

Download

Thank you for your interest

You now have access to Inspection of PCB Attachment to Power Inverter

A confirmation email has been sent to

Continue to page

Please or get direct access to download this document

Enhancing Inspection of PCB Attachment to Power Inverter

OMRON's innovative inspection technology recognizes the power module is a critical part of EV subassembly and allows for accuracy as well as speed when measuring each solder area during PCB attachment. Our solution improves inspection results while simultaneously optimizing product quality.

Challenge

For e-axle production, particularly inverter assembly, several layers of solder paste are required to increase conversion efficiency during the die bonding process. The area and thickness of these layers must be measured in order to achieve optimum product quality.

Solution

Automated inspection technology developed by OMRON specifically for this task helps to improve results and bolster product quality. OMRON's VT-X750 3D CT X-RAY is capable of inspecting each layer of solder paste in a way that preserves the integrity of the product while prioritizing the quality of the inspection.

Fast x-ray inspection

Inspect several layers of solder paste condition and thickness by Full 3D CT inspection.

Related Products

vt-x750 aoi machine fcard prod

VT-X750 3D CT X-RAY

X750 este utilizat pentru inspecţia nedistructivă a infrastructurii/modulelor 5G şi a componentelor electrice de la bordul vehiculelor, ca o inspecţie de înaltă definiţie şi de înaltă calitate, utilizând 3D-CT complet.

Read more

Call us to learn more

Contact your local sales office

Do you want to know more?

Most questions are answered within 24 hours

Inspection of PCB Attachment to Power Inverter

OMRON's innovative inspection technology recognizes the power module is a critical part of EV subassembly and allows for accuracy as well as speed when measuring each solder area during PCB attachment. Our solution improves inspection results while simultaneously optimizing product quality.

Please, complete all the fields marked with *. Your personal details will be handled confidentially.

Text error notification

Text error notification

Text error notification

Text error notification

Text error notification

Country error notification

Details

Text area error notification

Checkbox error notification

Checkbox error notification

Thank you for submitting your request. We will come back to you as soon as possible.

We are experiencing technical difficulties. Your form submission has not been successful. Please accept our apologies and try again later. Details: [details]

Download