Wafer undulation measurement
A direct-reflective laser from Omron can adjust the height of the inspection head quickly and accurately.
Challenge
Before inspecting the surface of a wafer, the height of the inspection head is adjusted to focus on the surface. It has to be done quickly and accurately, but the variety of surface conditions makes that difficult. To measure the height from surface on rotating wafers precisely, the response time should be as low as possible.
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Solution
Omron offers direct-reflective laser measurement solutions. The Omron algorithm, optical method and shape of the beam enable height measurement with higher resolution.
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Benefit
Precise and fast measurement improves yield and throughput.
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